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Epoxy resin for electronic components Encapsulation/Potting Buyer and Importer from Vietnam - Buying Lead

04 May, 2024

Epoxy resin for electronic components Encapsulation/Potting

CAS No.:61788-97-4 Other Names:Epoxy - Polyester Resin 50 50% powder MF:(C11H12O3)n EINECS No.:other Classification:Double Components Adhesives Main Raw Material:Epoxy Usage:Woodworking,Packing,Transportation,Footwear & Leather,Fiber & Garment,Construction Type:Liqulear:clear epoxy resin ab glue:clear epoxy resin AB glue

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