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RF HDI Low Volume PCB Assembly With Blind And Buried Vias And 1.5oz Outer Copper 1oz Inner Copper

  • Origin: China
  • Supply Type: oem service
  • Processing Time: 3-4Weeks
  • Min Order: 1
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Supplier Info.

  • Company Name Yingstar Electronics Co.,Ltd
  • Membership:Free
  • Business Type: Manufacturer, Trading Company, Buying Office, Agent, Distributor/Wholesaler, Government ministry/Bureau/Commission, Association, Business Service (Transportation, finance, travel, Ads, etc), Other
  • Employees Total
  • Annual Revenue

      • RF&HDI PCB assembly with blind and buried vias and 1.5oz outer copper,1oz inner copper

      • The specification of 6 layers Multilayer ENIG Circuit Board PCB for IR Remote Car Key is 32*32 mm, whcih is applied to IR Remote Car Key. The Copper thickness of the PCB is 1 Oz , with 0.1 mm minimum aperture.

      Layer Stackup Structure of this board

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