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2 Layer Temperature Seor FPC PCB Board Assembly 0.3mm Thickness1oz Copper And 5mil Conductive Spac

  • Origin: China
  • Supply Type: oem service
  • Processing Time: 3-4Weeks
  • Min Order: 1

Supplier Info.

  • Company Name Yingstar Electronics Co.,Ltd
  • Membership:Free
  • Business Type: Manufacturer, Trading Company, Buying Office, Agent, Distributor/Wholesaler, Government ministry/Bureau/Commission, Association, Business Service (Transportation, finance, travel, Ads, etc), Other
  • Employees Total
  • Annual Revenue

2 layer FPC temperature senor board 0.2mm+0.1mm stiffener, YINGSTAR produce the PCB, source all the components and do the assembly&testing for customer.YINGSTAR FPC board manufacturing capabilities:Flexible PCB (1-10 laye)Material: Kapton, Polymide, PET,Base copper thickness: 1/3oz, 1/2oz, 1oz, 2oz;Base PI thickness: 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil;Stiffener: Polyimide, Stainless stell, FR4,Surface finish: Immeion Gold/ SilveTin, OSP.Min widthpacing (1/3oz):0.05mm/0.06mmMin widthpacing (1/2oz): 0.06mm/0.07mmDetailed Specification of Flexible PCB Manufacturing

Technical Specification
Layers:1~10 (flex Pcb) and 2~8 (rigid flex)
Min Panel Size:5mm x 8mm
Max Panel Size:250 x 520mm
Min Finished board thickness:0.05mm (1 sided inclusive copper)
Max Finished board thickness:0.3mm (2 sided inclusive copper)
Finished board thickness tolerance:±0.02~0.03mm
Material:Kapton, Polyimide, PET
Base copper thickness (RA or ED):1/3 oz, 1/2 oz, 1oz, 2oz
Base PI thickness:0.5mil, 0.7mil, 0.8mil, 1mil, 2mil
Stiffner:Polyimide, PET, FR4, SUS
Min Finished hole diameter:Φ 0.15mm
Max Finished hole diameter:Φ 6.30mm
Finished hole diameter tolerance (PTH):±2 mil ( ±0.050mm)
Finished hole diameter tolerance (NPTH):±1 mil ( ±0.025mm)
Min width/spacing (1/3oz):0.05mm/0.06mm
Min width/spacing (1/2oz):0.06mm/0.07mm
Min width/spacing (1oz):Single layer: 0.07mm/0.08mm
Double layer: 0.08mm/0.09mm
Aspect Ratio6:018:01
Base Copper1/3Oz--2Oz3 Oz for Prototype
Size ToleranceConductor Width:±10%W ≤0.5mm
Hole Size: ±0.05mmH ≤1.5mm
Hole Registration: ±0.050mm
Outrance:±0.075mmL ≤50mm
Surface TreatmentENIG: 0.025um - 3um
OSP:
Immersion Tin: 0.04-1.5um
Dielectric StrengthAC500V
Solder Float288/10sIPC Standard
Peeling Strength1.0kgf/cmIPC-TM-650
Flammability94V-OUL

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