The TG190 double sided PCB Board is applied for peonal computer, based with FR4 board material. The specification of the PCB board is 182 * 180 mm, with green solder mask and OSP surface treatment. The minimum aperture is 0.3 mm and the h and space are 0.1 mm.
| 1 | Ball Grid Array (BGA) | 5 | Quad Flat Pack No-Lead (QFN) |
| 2 | Small Outgrated Circuit (SOIC) | 6 | Plastic Leaded Chip Carrier (PLCC) |
| 3 | Quad Flat Package (QFP) | 7 | Ultra-Fine Ball Grid Array (uBGA) |
| 4 | Package-On-Package (PoP) | 8 | Small Chip Packages (pitch of 0.2 mm) |
Technical requirement:
Quote requirement:
PCB and PCBA specification:
| Layer | 1-36 layer |
| Max Board Size | 1100*599mm 43.3" * 24" |
| Min Board Thickness | 4 layer 0.40mm 16mil |
| 6 layer 1.00mm 40mil | |
| 8 layer 1.20mm 48mil | |
| 10 layer 1.60mm 60mil | |
| Min space | 0.075mm 3mil |
| Min h | 0.075mm 3mil |
| Min hole size | 0.1mm 4mil |
| Plated wall thickness | 0.025mm 1mil |
| Plated hole dia tolerance | ±0.10mm 4mil |
| NO Plated hole dia tolerance | ±0.05mm 2mil |
| Outrance | ±0.15mm 6mil |
| Twist and bent | ≤1.5% |
| Board thickness tolerance | ±10% |
| Copper weight | 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz |
| Surface finish | HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc. |
| Board material | FR-4 glass epoxy, FR4 High Tg, RoHS |
| compliant; Aluminum, Rogers, etc. | |
| Insulation resistance | 1012Ω (Normal) |
| Through hole resistance | 300Ω(Normal) |
| Electric strength | 1.3KV/mm |
| Current strength | 10A |
| Peel strength | 1.5N/mm |
| Thermal stress | 28820 Seconds |
| Flammability | 94V-0 |
| Test voltage | 50-300V |
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