PCB (PCB Assembly) Process Capability:
- Technical Requirement
- Professional Surface-mounting and Through-hole soldering Technology
Various sizes lik components SMT technology
ICT(In Circuit Test),FCT(Functional Circuit Test) technology
PCB Assembly With UL,CE,FCCÂ Approval
Nitrogen gas reflow soldering technology for SMT
High Standard SMT&Solder Assembly n>
High density interconnected board placement technology capacity
- Quote&Production Requirement
Gerber File or PCB File for Bare PCB Board Fabrication
Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly
To reduce the quote time, please provide us the full part for each components,Quantity per board also the quantity for orders.
Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate
PCBA, PCB assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
- Other PCB Assembly Equipments
SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
Reflow Oven: FolunGwin FL-RX860
Wave Soldering Machine: FolunGwin ADS300
Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service
Fully Automatic SMT Stencil Printer: FolunGwin Win-5
