| Item Name | Low Temperature 138℃ Sn42/Bi58 Lead Free Solder Paste |
| Size | 42g |
| Weight | 0.1kg |
| Appication | For Phone BGA/CPU IC Welding |
| Function | For phone PCB circuit board repair |
| Capacity | Iphone /samsung |
| Feature | 138℃ Low Temperature Lead Free |
138 ° C Low Temperature Lead-free Solder Paste Sn42 / Bi58 BGA Flux for Apple Samsung Motherboard Welding Assistant. NAND Flash CPU Wifi BGA Soldering Repair, 42g 138℃ Sn42/Bi58 Lead Free Solder Paste for isamsung PCB circuit board repair like BGA welding or BGA Stenciling.138 ° C Low Temperature Lead-free Solder Paste Sn42 / Bi58 BGA Flux for Apple Samsung Motherboard Fix
138℃ Sn42/Bi58 Low Temperature Lead-free Solder Paste for BGA Soldering Repair
Two kinds of package:
1. Needle tube packaging:
FIX-230 Sn42/Bi58 42g
2. Canned package:
FIX-231 Sn42/Bi58 42g
Features:
Lead free (lead is harmful to human body, when welding the motherboard, people will breathe in lead, which is ces, not conducive to the health of the repairmen). Lead free is environmentally friendly. It contains no lead but silver, good conductivity and higher price.
The melting point of low temperature is about 138℃, Solder joints turn off, Good temperature and moisture, Full solder joint.
1. strong continuous printing performance, suitable for fine pitch IC and BGA and precision components welding.
2. good wettability, good resistance to cold collapse, thermal collapse and strong dry resistance.3. suitable for PCB welding with various high requirement materials, fine pitch and high precision components.4. It is full and bright after the solder paste is applied on PCB, and the residue is less white and transparent, and no fluorine and other highly corrosive substances.
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