Liquid-cooled servers, also known as water-cooled servers, refer to servers that inject liquid into the server and take away the heat from the server through heat and cold exchange. Generally speaking, the industry divides liquid cooling into direct cooling and indirect cooling. At present, direct cooling is mainly immersion liquid cooling technology, which can be divided into changing and non-changing, and indirect cooling is mainly cold plate liquid cooling technology.
Liquid-cooled servers, also known as water-cooled servers, refer to servers that inject liquid into the server and take away the heat from the server through heat and cold exchange. Generally speaking, the industry divides liquid cooling into direct cooling and indirect cooling. At present, direct cooling is mainly immersion liquid cooling technology, which can be divided into changing and non-changing, and indirect cooling is mainly cold plate liquid cooling technology.
Immersion liquid cooling technology is a cooling technology that uses liquid as the heat transfer medium, and the heating device is immersed in the liquid to exchange heat through Generally speaking, liquid cooling is to replace the gas CPU with liquid , and the heat generated by IT heating devices such as memory is taken away, just like local cooling of servers. "Showers" or even full "baths". At present, liquid cooling technology can be described as a hundred flowers blooming, and the common ones are cold plate liquid cooling, immersion liquid cooling, and air-liquid mixing.
Immersion liquid cooling technology is a cooling technology that uses liquid as the heat transfer medium, and the heating device is immersed in the liquid to exchange heat through Generally speaking, liquid cooling is to replace the gas CPU with liquid , and the heat generated by IT heating devices such as memory is taken away, just like local cooling of servers. "Showers" or even full "baths". At present, liquid cooling technology can be described as a hundred flowers blooming, and the common ones are cold plate liquid cooling, immersion liquid cooling, and air-liquid mixing.
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Changes in the market structure are more conducive to agile and innovative manufacturers. In the first half of 2022, the steady growth of Inspur Information is mainly due to the agile operation capabilities of its JDM (Joint Design Manufacturing) company, which has obvious competitive advantages in serving large data center customers, public cloud, artificial intelligence and other innovative businesses. The current Inspur AI server market share is 20.9%, and the multi-node server market share is 13.1%. To maintain the world's first place for a long time, the product layout of new market business will further promote the growth of server innovation.
According to Gartner analysis, the server market demand will continue to grow in the next five years. It is estimated that the global server market size will reach US$155.67 billion in 2026, and the compound growth rate will reach 8.3% by 2026. At the same time, with the development of ultra-large data centers and the transformation of traditional enterprises, the adjustment of market structure will be further deepened. For innovative technologies and energy-saving solutions such as multi-node servers, artificial intelligence servers, edge servers, liquid cooling, and natural air cooling in ultra-large data centers, server manufacturers need to pay more attention to the innovation needs of ultra-large customers. At the same time, enterprise users will develop more innovative services, accelerate the transfer from traditional infrastructure to emerging infrastructure, and promote the transformation of market demand from traditional solutions to cloud. AI, edge and other innovative technologies.
A strong fan needs to be installed around the motherboard of the server case for heat dissipation.
Liquid-cooled servers, also known as water-cooled servers, refer to servers that inject liquid into the server and take away the heat from the server through heat and cold exchange. Generally speaking, the industry divides liquid cooling into direct cooling and indirect cooling. At present, direct cooling is mainly immersion liquid cooling technology, which can be divided into changing and non-changing, and indirect cooling is mainly cold plate liquid cooling technology.
Immersion liquid cooling technology is a cooling technology that uses liquid as the heat transfer medium, and the heating device is immersed in the liquid to exchange heat through Generally speaking, liquid cooling is to replace the gas CPU with liquid , and the heat generated by IT heating devices such as memory is taken away, just like local cooling of servers. "Showers" or even full "baths". At present, liquid cooling technology can be described as a hundred flowers blooming, and the common ones are cold plate liquid cooling, immersion liquid cooling, and air-liquid mixing.
Immersion liquid cooling technology is a cooling technology that uses liquid as the heat transfer medium, and the heating device is immersed in the liquid to exchange heat through Generally speaking, liquid cooling is to replace the gas CPU with liquid , and the heat generated by IT heating devices such as memory is taken away, just like local cooling of servers. "Showers" or even full "baths". At present, liquid cooling technology can be described as a hundred flowers blooming, and the common ones are cold plate liquid cooling, immersion liquid cooling, and air-liquid mixing.
On September 28, Zhongke Sugon stated on the investor interaction platform that at present, enterprise liquid cooling products are mainly used in the field of data centers. The non-type liquid cooling technology uses liquid as the refrigerant to pass the heating components such as the CPU, memory, and power supply inside the equipment. The thermal IT equipment is generated in the form of se conversion heat, and the liquid cooling technology can be changed through immersion, which can help the data center to achieve natural cooling throughout the year, and the minimum PUE can be reduced to 1.04.
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The heat dissipation fan air guide cover and the heat sink on the CPU can significantly improve the CPU heat dissipation effect
The power supply part of the server should also be equipped with an auxiliary cooling fan. The power supply is large and the cooling is not good, and the power supply components are easy to age or even be damaged. Generally speaking, the function of the cooling fan inside the server is to accelerate the flow rate of the air on the surface of the radiator to increase the heat exchange rate between the radiator and the air.
In April last year , Yang Yuanqing, chairman and CEO of Lenovo Group, donated a national first-class green water-cooled high-performance computing center to Shanghai Jiaotong University, and the high-performance computing equipment was named "Siyuan No. 1". "Siyuan No. 1" adopts a heterogeneous computing rate design, equipped with the latest Intel® third-generation Xeon® CPU, and the latest architecture GPU co-processor to meet the needs of diverse scientific computing and artificial intelligence computing in the scientific research process. need. Using warm water cooling technology, "Siyuan No. 1" circulates heat based on 45-50 degrees warm water, and 90% of the system heat will be taken away by the water cooling system, which greatly improves energy utilization efficiency. The minimum value of PUE can reach about 1.1, and the pioneering waste heat recovery system can Achieve carbon offset of about 10%.
The heat exchange between the server and the outside mainly depends on the cooling fan of the server chassis.
Generally, the data center of a unit or organization is basically a very closed "computer room" that has been opened for a long time with low-temperature refrigeration.
In this computer room, the air-conditioning temperature is kept at 20° for a long time. The purpose of the internal temperature is to supplement the external cold air into the servers through the chassis fans, forcing a large of heated servers to cool down.
The heat dissipation of the server is to install the fan on the front of the chassis, so that the entire chassis has a huge airflow, so as to ensure that all devices (including) CPU, hard disk, memory stick, north-south bridge, RAID card, etc.) can get good heat dissipation, CPU Only passive heat sinks are installed, relying on overall airflow for heat dissipation. Therefore, the server generally uses a 10,000-rotation air duct fan (commonly known as a violent fan) to bring enough air volume to the entire chassis, but it is accompanied by huge noise. This article tries to use the heat dissipation method of ordinary desktop computers to install a radiator with a fan on the CPU, and replace the original air duct fan of the server to achieve a mute effect.
In the field of green energy saving, the continuous accumulation and research of basic capabilities such as basic materials, heat dissipation liquid working quality, and different types of liquid cooling technologies have created a complete liquid cooling technology capability, providing a full-stack liquid cooling solution from the computer room to the cabinet to a single server , to achieve extremely low PUE lower than 1.10.
In the field of green energy saving, the continuous accumulation and research of basic capabilities such as basic materials, heat dissipation liquid working quality, and different types of liquid cooling technologies have created a complete liquid cooling technology capability, providing a full-stack liquid cooling solution from the computer room to the cabinet to a single server , to achieve extremely low PUE lower than 1.10.
In the context of the development of the cloud computing industry, more and more data centers have been established. As the core equipment of the data center, the server has become an important index to measure the quality of the server because of its high performance, scalability and high cost performance. Due to the limited size of the server, whether many high-power electronic components can transfer the heat generated by the electronic components to the outside in a timely manner is directly related to the stability of the server operation. Therefore, the heat dissipation problem of the server has become a major obstacle restricting the development of the server. According to the analysis and arrangement of related server cooling technologies at home and abroad, it is not difficult to find the development route of server cooling technology and determine the server cooling technology.
1. Development route of server heat dissipation technology
The development of server cooling technology can be roughly divided into three stages:
( 1) The period from 1965 to 2000 was the embryonic period of technology: server cooling technology appeared abroad, but its development was slow. This is because the development of large-scale computers and servers has just started, and server cooling mainly draws on personal computer cooling technology, mainly traditional air cooling Technology, liquid cooling technology also appeared, mainly electronic components are immersed in non-conductive cooling liquid, due to the development of material technology at that time, the manufacturing cost of heat sink was high.
( 2) The period from 2001 to 2009 is the mature period of technology: With the advent of the Internet era, the heat dissipation requirements of servers are getting higher and higher. In addition to improving traditional air-cooling technology and liquid cooling technology, there is also fan control intelligent control technology. With the development of material technology, the manufacturing cost of radiator is also reduced.
( 3) 2010 is a period of rapid development: with the development of cloud computing, more data centers have been established, more and more servers need to be arranged in a limited space, and the heat dissipation problem has become the one problem that data centers need to solve . At this time, intelligent control technology has become the focus of research, and the emergence of new heat dissipation materials has also brought new vitality to the field of heat dissipation.
2. Server cooling technology
Server cooling technologies mainly include: air cooling, liquid cooling, heat transfer and intelligent control. Among them, air-cooled heat dissipation and liquid-cooled heat dissipation are still the two core technologies in the field of server heat dissipation technology. In addition, one of the biggest technical characteristics in the field of server cooling is that cooling technology is rarely used alone.
(1) Air cooling
In simple terms, the principle of air cooling is to direct the wind direction, blow cold air into the heating the heating nt>Common technologies are fans and hoods. The former can use an exhaust fan or a blower fan, and the latter can guide the wind direction according to a specific air duct to generate a specific airflow direction during the heat dissipation process.
Its representatives are:
1. Install a large of cooling devices on the main board of the server, through which the electronic components on the main board generate heat, and then install a large of fans under the server cabinet, and the airflow generated by the fans takes away the heat to achieve the cooling effect.
2. Place the air guide cover on the electronic components of the server motherboard, connect the front end with the fan group to form an air inlet, and set the rear end at the rear end of the motherboard to reduce the diameter of the air outlet and create a convection area. At the same time, the partition part divides the convection area, and the area formed by the isolation part, the sealing part and the partition part is a corresponding air channel, and the thermoelectric d in the air channel, and the heat generated is taken away by the air flow in the air channel to achieve the cooling effect.
(2) Liquid cooling
The principle of liquid cooling is to choose the form of heat convection or heat conduction, and take away the heat of the heating he immersion or flow of liquid. Common liquid cooling methods are: immersion and liquid cooling loops. Since electronic components are easily damaged in water, the immersion liquid is oil, chloride and other non-conductive liquids. The liquid cooling circuit the electronic components with a closed liquid circuit, and the heat generated by the electronic components is taken away by the liquid flow. The liquid is usually cold water.
The principle of heat transfer is to select the heat dissipation method of heat conduction to transfer heat from a high-temperature object to a low-temperature object. Common heat dissipation technologies are: radiators, cooling plates and semiconductor plates. The heat dissipation technology of the semiconductor board is based on the principle of Peltier,
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