Fiber Laser Processing System for Ceramics

This system features outstanding scribing and cutting capabilities. It is equipped with an infrared pulsed laser whose peak power output is 10 times greater than its average power output. Optimized electronic control and optics systems allow the machine to deliver small laser spot sizes and narrow cutting/scribing hs during planar processing and three-dimensional curved surface processing.

Features

Small laser spot size; narrow h.

â—† Small heat-affected zone.

â—† Flexible non-processing, able to process any shape.

â—† Layer-by-layer processing; switchable gas source.

â—† Image target capturing for automatic processing.

Technical Specification

Model: RPS03

◆ Positional accuracy: ±4μm (JIS Standard)

◆ Repeatability: ±2μm (JIS Standard)

◆ Minimum drilling aperture: 30μm

◆ Minimum cutting h: 20μm

â—† Scribing speed: 200mm/s

◆ Processable material thickness: ≤2mm

â—† Maximum cutting speed: 40mm/s

â—† Hole-drilling speed: >8 holes per second

◆ Hole-drilling diameter range: 40-400μm