KetaSpire® PEEK (polyetheretherketone) offers the best combination of fatigue resistance and chemical resistance. PEEK chemical resistance is similar to that of PPS (polynylene sulfide). However, PEEK can operate at higher temperatures and retains its exnt mechanical properties at continuous-use temperatures up to 240 °C (464 °F), allowing it to replace metal in severe end-use environments. Glass fiber-reinforced and carbon-fiber-reinforced grades, as well as specialty grades, provide a wide range of performance options.
Find here KetaSpire® PEEK gradesPEEK SOLVAY KetaSpire® KT-1211FP
PEEK SOLVAY KetaSpire® KT-810/FP
PEEK SOLVAY KetaSpire® KT-820
PEEK SOLVAY KetaSpire® KT-820 GF13/GF15/GF30
PEEK SOLVAY KetaSpire® KT-820 CF30
PEEK SOLVAY KetaSpire® KT-820 NL
PEEK SOLVAY KetaSpire® KT-820 SL10/SL30/SL45
PEEK SOLVAY KetaSpire® KT-820P/FP/SFP/UFP
PEEK SOLVAY KetaSpire® KT-850/P
PEEK SOLVAY KetaSpire® KT-851/NL/NL SP
PEEK SOLVAY KetaSpire® KT-880
PEEK SOLVAY KetaSpire® KT-880 CF30/CF40/ACF30
PEEK SOLVAY KetaSpire® KT-880 FW30/FW31
PEEK SOLVAY KetaSpire® KT-880 GF15/GF20/GF30
PEEK SOLVAY KetaSpire® KT-880 NL/SL30
PEEK SOLVAY KetaSpire® KT-880P/FP/SFP/UFP
PEEK SOLVAY KetaSpire® XT-920
PEEK SOLVAY KetaSpire® XT-920 FP
PEEK SOLVAY KetaSpire® XT-920 GF30
PEEK SOLVAY KetaSpire® XT-920 CF30
PEEK SOLVAY KetaSpire® CF10 HC AM Filament
PEEK SOLVAY KetaSpire® CF10 LS1 AM Filament
PEEK SOLVAY KetaSpire® MS NT1 AM Filament
PEEK SOLVAY KetaSpire® NT1 HC AM Filament
KetaSpire® PEEK Properties
* Exceptional chemical resistance to organics, acids and bases
* Very good wear and abrasion resistance * Best-in class fatigue resistance * Exnt dimensional stability
* Exnt resistance to hydrolysis in boiling water and superheated steam * Superior dielectric with low loss at high temperatures and frequencies * Ease of processing * High purity
KetaSpire® PEEK Applications
* Aircraft Parts.
* Automotive Parts.
* Instruments; sterilization cases and trays; operating room equipment; diagnostic equipment; reusable medical devices.
* Compressor rings, plates, pipes and tubing; seals and back-up seal rings; electrical connectors and components; pipes and tubing for risers and umbilicals; labyrinth seals; bearings; bushings; wear tapes; le. * Semiconductor fabrication and testing; CMP rings; wafer carriers; etch rings; pins and fasteners; in-process trays and transport media.
