1. The clamping is realized by the column with the card slot and the clamping mechanism. After the position of the clamping position is found by the displacement sensor, the snap ring of the clamping mechanism is clamped under the pushing of the cylinder, and after the clamping is in place, the pressing action is completed by the annular pressing cylinder. 2. The double-conducting column is equipped with different heights of card slots to adapt to different high molds. 3. The structure is simple, easy to process with high accuracy, and the force at each point of the mold can be ensured.