Optimal, fully-automated processing, accurate registration processes and reliable through-plating technologies guarantee the supreme quality and reliability of our products. Rising frequencies require impedance-controlled circuits and increasingly higher . Multilayer circuits also allow the separation of analog and digital parts on a circuit board.
We started manufacturing multilayer circuit boards as early as 1985. However, today's products are very different from the pioneers of that time. The multilayer circuits of today are characterised by ultra-thin cores of 50 µm thickness, and micro-structures that nonetheless feature a higher of layers.
When developing and designing new solutions, we are driven by the principle of smaller, lighter, thinner and yet with an increasing of functions.
The higher packaging densities of components require new layout structures. Integrated blind and/or buried vias, copper-filled blind vias and plugged vias are state of the art and manufactured by VARIOPRINT with maximum process stability. The latest laser systems for drilling and contouring and the most advanced vertical electroplating facility in Europe guarantee the highest possible product quality.
Design and technology Multilayer and HDI circuits with up to 28 layers in a diverse choice of materials. Blind vias, buried vias, μVias with and without copper fill and plugged vias with/without overplating. |
| Dimension and formats Thickness 0.2 mm to 4.8 mm Format up to 569x490 mmPanel formats used 460x610 mm und 530x610 mm |
Solder resists and additional prints to-sensitive solder mask in different colours, applied by spray coating and screen printing Registration solder mask Standard: +-50 µm Special: +-25 µm possible Additional prints, such as legend print, peelable mask and carbon print |
| Conductive pattern structuring Copper cladding from 18 μm to 210 μm Conductor widths and spacings Standard: 75 µm / 100 µm Special: 50 µm / 50 µm possible |
Mechanical machining Contour milling Depth milling Scoring Laser processing Annular rings Standard: 100 µm Special: 75 µm |
Materials FR4, TG 135 °C with filler FR4 high TG 170 °C Halogen-free materials PTFE materials Special materials Standard glass fabric typ and 7628, additional types according to requirement and design |
| End surfacesVarious chemical and galvanic gold surfaces and chemical tin and silver surfaces, as well as pure organic protective coatings |
| Electroplating and copper platingAspect ratio up to 1:12 with 0.15 mm drill diameter 1:15 with 0.3 mm drill diameter Copper in vias in accordance with IPC II, IPC III or customer specific |
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