According to the printed circuit board, chip and other materials provided by the customer, the internal circuit of the chip is connected with the package pin or the circuit board. (Under the action of pressure and vibration, the surface of the metal to be welded rubs against each other, the oxide film is destroyed, and plastic deformation occurs. The two pure metal faces are in close )After the bonding is completed, the chip is generally encapsulated by black glue.
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