SMT Manufacturing Capability | |||
Item | Manufacturing Capability in process | Manufacturing Method | |
Production size(Min/Max) | 50×50mm / 500×500mm | ||
Production board thickness | 0.2 ～ 4mm | ||
Printing solder paste | Support method | Magnetism fixture, vacuo platform | |
Clamping method | Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board | ||
Cleaning Method of printing solder paste | Dry method+ wetting method+ Vacuo method | ||
Accuracy of printing | ±0.025mm | ||
SPI | Repeated accuracy of volume | <1% at 3σ | |
Mounting component | Components size | 0603(Option) L75mm Connector | |
Pitch | 0.15mm | ||
Repeated accuracy | ±0.01mm | ||
AOI | FOV size | 61×45mm | |
Test speed | 9150mm²/Sec | ||
3D X-ray | Shootingangle | 0-45 | |
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