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ESS (Energy Storage Systems) Prototype PCB Assembly - Grande Electronics

  • Origin: China
  • Supply Type: oem service
  • Processing Time: 10-15 days

Supplier Info.

  • Employees Total 101-200
  • Annual Revenue

Supplier:Â GrandeÂ

Layers:4Application:Â ESS (Energy Storage Systems) Prototype PCB Assembly - Grande ElectronicsPCB:FR4/1.6mm/1ozMin Via:Â 0.2mmSurface Treatment:Â HASLPCBA Lead time:Â 3-4 weeksTesting:Â 100% E-test

Standard Warp:<0.75%

Â

[Description]1, Turnkey solution for ESS (Energy Storage Systems) Prototype PCB Assembly - Grande Electronics2, PCB Assembly, PCB fabrication / PCB layout, PCB Reversing.3,  Full Bespoke PCBA/ OEM/ EMS(Electronics Manufacturing Services).4, SMT&DIP&PTH&BGA.5, Components Sourcing.6, Quick PCBA prototype.7, X-ray test, ICT and Functional Circuit Test.8, Sample and small batch order are accepted.PCBA ServiceCustomer offers: Gerber file, PCB Specification, BOM and Assembly Drawing.Full-turnkey PCBA: 1-30Layers PCB, Components Sourcing, SMT, PCBA testing, PCBA Aging test, PCBA Packing and PCBA Shipping.PCBA Quality Assurance1, Certifications: UL, SGS, TUV, BV, ROHS, ISO9001: 2008, TS16949: 2008 2, 7 t-proof SMT DIP >3, All s wear anti-static and dust-proof clothing.4, All operators should pass strictly training before they start work.5, SMT Equipment:solder paste printer in Jidakang,, Mounter in Panasonic, Re-flow, Wave Soldering, Semi-auto DIP6, PCBA Test Equipment: ORT, Constant temperature and humidity chamber,3D CMM,X-Ray.7, PCBA Test:ICT, Functional Circuit Test and X-ray test.8, Package Processed:0402, 0603, 0805, 1206, 1608, 2125, 3216Micro QFP 0.2mmFlip-chip, BGA, ConnectorsBGA Ball Pitch=0.2mm9, Each workstation in accordance with the SOP 10, Materials:FR-4, FPC, Aluminum,High TG,Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.11, Material Brand:KB, SHENGYI, NANYA and so on. PCBA Lead TimePCBA prototype: 7-10 working days after contract signed and EQ confirmed. Mass production: partial delivery according to the customer’s requirement.Other information for PCBA1, The mass production will be arranged after PCBA prototype confirmed. 2, Use Teflon adhesive tape to protect Mount Holes and GND Holes.3, EPE is used to avoid impact and crash.PCBA Standard PackingAnti-static bag and compartmental packing

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