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High Corrosion Resistance Tantalum Sputtering Deposition System

  • Origin: China
  • Supply Type: oem service

Supplier Info.

  • Employees Total 11-50
  • Annual Revenue
PRODUCT DESCRIPTION

Magnetron Sputtering is widely used to deposit refractory metals like tantalum, titanium, tungsten, niobium, which would require very high temperatures of deposition, and precious metals: Gold and Silver and which is also used for deposition of lower melting points metals like copper, aluminum, nickle, chrome etc.

Tantalum is most used in the electronic industry as a protective coating because of its good resistance to erosion.

Applications of Sputtered Tantalum thin film:1. Microelectronics industry as the films can be reactively sputtered and thus resistivity and temperature coefficient of resistance can be controlled;

  • Medical instruments like body implants for its highly biocompatability property;
  • Coatings on corrosion resistant parts, such as thermowells, valve bodies, and fasteners;
  • Sputtered tantalum can be also be used as an effective corrosion resistance barrier if the coating is continuous, defected and is adherent to the substrate is intended to protect.
  • High Corrosion Resistance Tantalum Sputtering Deposition System 0High Corrosion Resistance Tantalum Sputtering Deposition System 1

    Technical Advantages

  • A standardized trolley is applied which allows easy and safe loading/unloading of the substrate holders and work pieces in/out of the deposition chamber
  • The system is safety interlocked to prevent incorrect operation or unsafe practices
  • The substrate heaters are provided which mounted in the center of chamber, PID controlled thermocouple for high accuracy, to enhance the condense film’s adhesion
  • Strong vacuum pumps configurations with Magnetically suspension molecular pump via gate valve connected to chamber; backed with Leybold’s roots pump and two stage rotary vane pump, mechanical pump.
  • High energy ionized plasma source is applied with this system to guarantee the uniformity and density.High Corrosion Resistance Tantalum Sputtering Deposition System 2High Corrosion Resistance Tantalum Sputtering Deposition System 3
  • Royal Technology’s standardized Tantalum sputtering deposition system:

    Main Configurations
    MODELRTAS1000
    TECHNOLOGY

    Pulsed DC magnetron sputtering

    Cathodic arc plating (for option, determined by coating process)

    CHAMBER MATERIALStainless Steel (S304)
    CHAMBER SIZEΦ1000*1000mm (H)
    CHAMBER TYPED shape, cylindrical chamber
    ROTATION RACK & JIG SYSTEMSatellite driving or central driving system
    POWER SUPPLIES

    DC Sputtering Power Supply: 2~4 setsBias Power supply: 1 set

    Ion Source: 1 set

    DEPOSITION MATERIALTa, Ti/Cr/TiAl, Au, Ag, Cu etc.
    DEPOSITION SOURCEPlanar Sputtering Cathodes + circular arc cathodes
    CONTROLPLC(Programmable Logic Controller) + IPC( manual+ auto+ semi-auto operation models)
    PUMP SYSTEMRotary Vane Pump: SV300B – 1 set (Leybold)
    Roots Pump: WAU1001 – 1 set (Leybold)
    Holding Pump: D60C – 1 set (Leybold)
    Magnetic Suspension Molecular Pump:MAG2200 – 2 sest (Leybold)
    GAS MASS FLOW CONTROLLER2 channels: Ar and N2
    VACUUM GAUGEInficon or Leybold
    SAFETY SYSTEMNumerous safety interlocks to protect operators and equipmen
    HEATINGHeaters: 20KW. Max. temp.: 450℃
    COOLINGIndustrial Chiller (Cold Water)
    POWER MAX.100KW (Approx.)
    AVERAGE POWER CONSUMPTION45 KW (Approx.)
    GROSS WEIGHTT (Approx.)
    FOOT PRINT( L*W*H) MM
    ELECTRICAL POWER

    AC 380V/3 ses/50HZ / 5 div>

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