Magnetron Sputtering is widely used to deposit refractory metals like tantalum, titanium, tungsten, niobium, which would require very high temperatures of deposition, and precious metals: Gold and Silver and which is also used for deposition of lower melting points metals like copper, aluminum, nickle, chrome etc.
Tantalum is most used in the electronic industry as a protective coating because of its good resistance to erosion.
Applications of Sputtered Tantalum thin film:1. Microelectronics industry as the films can be reactively sputtered and thus resistivity and temperature coefficient of resistance can be controlled;
Technical Advantages
Royal Technologyâs standardized Tantalum sputtering deposition system:
Main Configurations | |
MODEL | RTAS1000 |
TECHNOLOGY | Pulsed DC magnetron sputtering Cathodic arc plating (for option, determined by coating process) |
CHAMBER MATERIAL | Stainless Steel (S304) |
CHAMBER SIZE | Φ1000*1000mm (H) |
CHAMBER TYPE | D shape, cylindrical chamber |
ROTATION RACK & JIG SYSTEM | Satellite driving or central driving system |
POWER SUPPLIES | DC Sputtering Power Supply: 2~4 setsBias Power supply: 1 set Ion Source: 1 set |
DEPOSITION MATERIAL | Ta, Ti/Cr/TiAl, Au, Ag, Cu etc. |
DEPOSITION SOURCE | Planar Sputtering Cathodes + circular arc cathodes |
CONTROL | PLC(Programmable Logic Controller) + IPC( manual+ auto+ semi-auto operation models) |
PUMP SYSTEM | Rotary Vane Pump: SV300B â 1 set (Leybold) |
Roots Pump: WAU1001 â 1 set (Leybold) | |
Holding Pump: D60C â 1 set (Leybold) | |
Magnetic Suspension Molecular Pump:MAG2200 â 2 sest (Leybold) | |
GAS MASS FLOW CONTROLLER | 2 channels: Ar and N2 |
VACUUM GAUGE | Inficon or Leybold |
SAFETY SYSTEM | Numerous safety interlocks to protect operators and equipmen |
HEATING | Heaters: 20KW. Max. temp.: 450â |
COOLING | Industrial Chiller (Cold Water) |
POWER MAX. | 100KW (Approx.) |
AVERAGE POWER CONSUMPTION | 45 KW (Approx.) |
GROSS WEIGHT | T (Approx.) |
FOOT PRINT | ( L*W*H) MM |
ELECTRICAL POWER | AC 380V/3 ses/50HZ / 5 div> |