Fr4 Laminate ENIG Double Sided PCB

Test Item

Test Method

(IPC-TM-650)

Test Condition

Unit

Specification

Typical Value

Thermal

Thermal

Stress

24.13.1

Float 288℃/Unetched

Sec

≥10

≥240

Glass Transition

(Tg)

2.4.25

E-2/105 DSC

℃

≥10

175

CTE/ Z-Axis Expansion

2.4.24

Al 1

ppm/℃

≤60

40

Al 2

≤300

200

50 - 260 ℃

%

≤3.0

2.2

X/Y CTE

2.4.24

40℃ - 125℃

ppm/℃

——

12/15

T-260

2.4.24.1

TMA

min

≥30

＞60

T-288

2.4.24.1

TMA

min

≥15

＞60

TD(5% weight loss)

2.4.24.6

TGA

℃

＞340

385

Flammability

UL94

E-24/ 23

Rating

V-0

V-0

Electrical

Surface Resistivity

2.5.17.1

C-96/35/90

MΩ

≥104

3.7*108

Volume Resistivity

2.5.17.1

C-96/35/90

MΩ-cm

≥106

4.3*109

Dielectric Breakdown

2.5.6

D-48/ 50+D0.5/ 23

kV

≥40

≥45

Dielectric Constant

2.5.5.2

Etched

(RC 50%)

@ 1 MHz

@ 1 GHz

—

≤5.4

4.8

4.6

Loss Tangent

2.5.5.2

Etched

(RC 50%)

@ 1 MHz

@ 1 GHz

—

≤0.035

0.012

0.013

CTI

IEC60112

A

V

——

＞600

Arc Resistance

2.5.1

D-48/ 50+D-0.5/ 23

Sec

≥60

121

Mechanical

Peel Strength (1 oz.)

2.4.8

125 ℃

N/mm

≥0.70

1.3

Float 288 ℃/ 10 Sec

≥1.05

1.4

After Process Solution

≥0.80

1.1

Flexural Strength

2.4.4

Length Direction

N/mm2

≥415

602

Cross Direction

≥345

534

Moisture Absorption

2.6.2.1

D-24/23

%

≤0.5

0.11