Semi automatic bga rework station DH-A2E

â… .Features:

1.Optical alignment which makes a chip accurately aligned,exactly avoid misplacement even shifting;

2.Automatically remove,pick up and solder,etc. Which can be exactly instead of a veteran;

3.No damage to devices during desoldering and soldering (including damage of appearance and function);

4.The desoldering and soldering process does not affect the periry and back of the chip;

5.For the preheating temperature, the luminous heating tube is used. The temperature increased is fast and the constant temperature is stable, and the PCBA desoldered and soldered does not change color or deform;

6.External temperature measurement interface, convenient to detect the temperature at any time, the tem-perature control is more accurate and reliable;

7.Touch screen operation, the program is preset in advance, without professional technical training can be skilled in use, so that the chip disassembled and welded becomes very simple

8.Manual and automatic operation of the two modes, debugging or batch-repair are more convenient and simple;

9.External usb interface for software updates and import of various repair data into computer analysis and storage;

10. Disassembling and welding of lead-free or lead products are applicable;

11.Suitable for multiple patch device repair (POP, SOP, SOJ, qfq, QFN, BGA, PLCC, SCP ... );

II. Product parameter

Power supply: AC220V±10% 50/60Hz

Total Power: 6000W

Upper heater: 1200W

Bottom heater: 2nd heating area/ 1200W，3rd heating area/3600W

（expanded preheating square for bigger motherboards）

Dimensions: L600×W700×H850 mm

Repair product range:

Repair BGA, QFN, BFP, LED lamp-beads (tape or in bulk),

special and refractory components including CGA, BHA,

QEN, CSP, LGA, microSMD, MLF(microleadfeames)

Operation mode: Automatic and manual modes been optional, HD touch

screen, intelligent man-machine dialogue, digitizedation

system Settings

Chip feeding: With a robot hand to automatically take or put, and feed or pick.

Profile Storage: 100,000.00 groups

CCD Camera optical Alignment: Auto-stretch to open / Auto-fold for storage

Camera pixel 2 millions, industrial-level

Resolution ratio: 1920x1080, HD 1080p, FHD support

PCBA Positioning: Up and down intelligent positioning, the bottom "5 point

support" with v-type card slot fixing PCBA which can be

freely adjusted in X-axis direction, with external universal

fixtures

BGA position: Laser positioning v-shaped card slot and universal fixtures

Temperature control: K Sensor,Closed loop.8-channel temperature control

system, PID automatic regulation

Temp accuracy: ±1℃

Position accuracy: ±0.01mm

PCB size: Max 400×450 mm Min 22×22 mm

Minimum chip spacing: 0.1mm

Safety monitoring: Full-process automatic monitoring, automatic control,

automatic correction, automatic alarm hint

External Temperature Sensor: 1 pcs，(optional）

Net weight: 80kg