| After Warranty Service | Video technical support |
| Product name | BGA IC chips remove machine |
| Suitable chip type | Micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc |
| Chip size | 2*2-80*80mm |
| Temperature Accuracy | ±2℃ |
Dinghua BGA rework station DH-5830
1.High success rate of repairing chips.Precise temperature control ensure temperature change according to the materials of the solder balls.
2.Precise temperature control.Target chip can be soldered or desoldered while no other components on PCB are damaged.
(1)No false welding or fake welding.
(2)The frequency of one PID value running in one cycle is about 10 milliseconds while one cycle time of one PID value of our competitors is about 40-60 milliseconds. The faster it captures the frequency, the more precise its temperature control is.
(3)Hot air nozzle is made of Titanium alloy without being rusted,out of shape or discolored.When temperature is too high for the chip,backflow tank design makes hot air reflux to ensure that the bridge will not be detonated, and the periral components will not be damaged at the same time.
(4)Three independent heating areas increase temperature gradually,which cannot damage IC chip.Even after PCB has been repaired for times,the appearance and functions of PCB are not affected.
5.Humanized design makes the machine easy to operate. Normally a worker can learn to use it in 10 minutes. No special professional experiences or skills is needed, which is time- and energy-saving for your company.
6.Suitable for various types of PCB of any size.
7. Superior materials guarantee long life span.Cross-flow,upper and bottom cooling fan cool the machine automatically as soon as heating proccess is finished,which effectively avoids deterioration and aging of machine.3-year warranty for heating system is offered.
8.Lifetime unlimited technical support and free training are offered.
9.The super bright LED headlamp is imported from Taiwan Top manufacturer.It can help you clearly see the melting condition of solder ball and check if there is any dirt on the PCB and chip.
10.There is an Emergency stop is case of any emergency.
IR6000 bga rework station ic chips remove reballing machine
Specification of DH-5830 BGA Rework Station:
| Power | 5500W |
| Top heater | Hot air 1200W |
| Bottom heater | Hot air 1200W,Infrared 3000W |
| Power supply | AC220V±10%,50/60HZ |
| Dimenssion | L480*W420*H650 mm |
| Positioning | V-groove PCB support,and with external universal fixture |
| Temperature control | K type thermocouple,closed loop control,independent heating |
| Temperature accuracy | ±2℃ |
| PCB size | Max 420*400 mm,Min 22*22 mm |
| Workbench fine-tune | ±15 mm forward/backward,±15 mm right/left |
| BGA chip | 2*2 - 80*80 mm |
| Minimum chip spacing | 0.15 mm |
| Temp sensor | 1(optional) |
| Net Weight | 31 KG |
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