Product Name | Automatic BGA rework station |
Application | Rework BGA |
Voltage | AC110~220V 10% 50/60HZ |
After Warranty Service | Online Support Video Technical Support |
Advantage | Automatic High Precision |
â . Function/Features:
1. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset;
2. Automatic disassembly, automatic welding, automatic recovery of chips, completely liberating workers;
3. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is more efficient, and the rework of the large chip is better;
4. Laser positioning, place the motherboard in one step;
5. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant
temperature, environmental protection and energy saving, and beautiful appearance;
6. External temperature measurement interfaces, convenient for temperature detection at any time,
temperature control is more accurate and reliable;
7. Touch screen operation, preset program, which can be used proficiently without professional technical
training, making chip repair very easy;
8. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple;
9. An external USB interface is used for software updates and various repair data to be imported into the
computer for analysis and storage;
10. The large preheating temperature zone can satisfy the rework of the large motherboard of 550*650mm.
11.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)
â ¡. Product parameter
Power Supply: AC220V±10ï¼ 50/60Hz
Total Power: 9200W
Top heater: 1200W
Bottom heater 1200W
IR preheating area: 6400W (Germany heating tube, heating area of 680 *475mm)
Operation mod: Fully automatically disassemble,suction,mounting and soldering
Dimensions: L1080ÃW1500ÃH950 mm
Basic configuration: Automatic feeding delivery system+HD digital
camera+Japanese Misumi suction rod system+Panasonic CCD
optical counterpoint system+HD digital display PC +upper
computer+Panasonic servo+Panasonic PLC+an 8-inch digital
touchscreen +Grinding level guide rail(Taiwan Hiwin)+Dalian
Institute of Technology 10-channel temperature control
system+ American Omega Temperature measurement
system+High fever efficiency and heating tube+ Resistance to
1800 degree black crystal sand glass
Chip feeding system: Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage: 50000 groups
Optical CCD lens: Automatic stretch out and go back, which can be moved freely
before and after the rocker, to eliminate the "observation dead
corner" problem
IR preheating area: 680Ã475mm
Chip angel adjust: Φ Angle can be 360° rotation, precision fine tuning fitting
suction nozzle
PCBA Positioning: Up and down intelligent positioning,bottom "5-point support"
with V-groove fixed PCB which can be adjusted freely in the
X-axis direction, with universal fixtures meanwhile
BGA position: Laser positioning to quickly find the vertical point of the upper
and lower temperature zone and the central point of BGA
Temperature control: K-type Sensor,Closed loop and 8~20 segments for temperature
controlling program
Temperature accuracy: ±1 â
Placement Accuracy +/-0.01mm
CCD system: A CCD HD digital camera, 2 million pixels, automatic optical
zoom, laser positioning
Pressure sensor: Inductive pressure greater than 10-30g (set up) will initiate
collision pressure protection
Safety guard pressure sensor + infrared sensor. Double guard.
Workbench fine-tuning: Back/front±15mm,left/right±15mm
PCB size: Max 650Ã550 mm Min 10Ã10 mm
PCB thickness: 0.2-15mm
BGA chip: 2Ã2-100Ã100mm
Gas source: Built-in vacuum pump, no external gas source
BGA suction mode: Negative pressure vacuum suction, automatic induction release
in place
BGA weight: 5-200g (special specification customization)
Minimum chip spacing: 0.15mm
External Temperature Sensor: 5 pcsï¼optional)
Machine type: Desktop table (optional)
Net weight: 150kg