| Color | Black |
| Viscosity | 15000cps～20000cps |
| Cure Condition | 30Min@80℃ |
| Glass Transition Temperature | 65℃ |
| Hardness | ≥70D |
| Shear Strength | 15Mpa |
| Storage Condition | 6months@-20℃ |
| Packaging | 30ml/50ml |
This product is a single-component, low-temperature, fast-heat-curing modified epoxy resin adhesive—exnt adhesion between many different materials at lower temperatures and in a short time. The product has exnt working performance and high storage stability.
Application: Bonding for camera module, LED backlight and low temperature process component.
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