DOCBOND|Underfill

The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, effectively reducing the impact caused by the mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allow for better underfilling; and good reworkability

Application：

Mobile , smart terminals, onboard vehicles, Other handheld devices, etc. Filling of CSP/BGA