Olympus, a world leader in nondestructive testing technologies, is pleased to announce the introduction of the new BondMaster 600 Bond Tester that is designed to nondestructively inspect bonds in honeycomb or laminate composites or metal-to-metal parts. This portable multimode adhesive bond testing instrument uses pitch-catch modes, mechanical impedance analysis (MIA), and resonance technologies to inspect materials that are commonly used in aerospace, energy, and automotive industries.
The BondMaster 600 incorporates the latest advancements in high-performance bond testing technologies into one compact, durable unit with a vivid 5.7 inch full-screen VGA display capable of producing user-selectable, highly contrast ighting conditions.
The BondMaster 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamerface that features convenient presets for common applications. The enhanced user interface and simplified workflow of the BondMaster 600 offers archiving and reporting that are accessible to any level of user.
The resolution and brightness of the 5.7-inch VGA screen on the BondMaster 600 handheld bond tester becomes even more apparent when switched into full-screen mode. Activated by the simple touch of a key, the full-screen mode is always accessible regardless of the display mode or inspection method you are using. The BondMaster 600 bond tester is programmed for a range of standard inspection methods, including pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance, as well as a notably improved mechanical impedance analysis (MIA) method.
Key Features
Link: ;keyword=OLYMPUS%20BONDMASTER%20600%20MULTIMODE%20BOND%20TESTER%20SALE!!&category_id=0&product_id=139
Price $3,100.00
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