For Turnkey PCB Assembly, all you need to do is to send us your PCB assembly Bill of Materials (BOM) list. ( a document or a spreadsheet format containing the PCB specification selection ), the of layers, quantity, and all dimensions necessary. In addition, you also need to include a CAD-generated Gerber or Centroid file for the top/bottom copper, Silkscreen and other details.Next, we will send a formal quote for your order approval before production . you can fix it if there’s any problem .A summary of the process for a turnkey PCB assembly order :
Place OrderComponent procurementPCB DesignPCB AssemblyQuality assurance and testingPrototypingPackingShippingAftersales services and support
| FACTORY CAPABILITIES | |||
| No. | Items | 2019 | 2020 |
| 1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
| 2 | Max layer count | 32L | 36L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.075mm Mechnical 0.15 | Laser 0.05mm Mechnical 0.15 |
| 5 | Min h/Space | 0.035mm/0.035 | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
| 10 | Min.BGA PAD | 0.15mm | 0.125mm |
| 11 | Max Aspect Ratio | 10:1 | 10:1 |
| 12 | Bow and Twist | 0.50% | 0.50% |
| 13 | Impedance Control Tolerance | +/-8% | +/-5% |
| 14 | Daily output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI | |
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