Layer Count & Material | |||
Layers | 1-8Layers | Maximum Panel Size | 19.6*31.0 inch |
Maximum Single Unit Size | 9inch*14inch ï¼limitation is 9inch*23inchï¼ | Minimum Panel Size | 9.0*12.0 inch |
Board Size Tolerance | ±0.1mm | Maximum Finished Board Thickness | 0.80mm |
Minimum Finished Board Thickness | 0.05mm | ||
Trace/ | |||
Minimum h for Inner Layers | 3mil | Minimum ing for Outer Layers | 3.5mil |
Minimum h for Outer Layers | 3mil | The Copper Thickness for Inner Layers | â¤2OZ |
Minimum ing for Inner | 3mil | The Copper Thickness for Outer Layers | â¤3OZ |
Drilling | |||
Minimum Hole Diameter | 0.15mm | Minimum Distance from Hole to Board Out | 8mil |
Maximum Hole Diameter | 6.4mm | Minimum Size for Hole Ring | 4mil ï¼Partially 3.2milï¼ |
Hole Diameter Tolerance | ±2mil | The Minimum BGA Bonding Pad Design | â¥8mil (7mil is the Limitation) |
The Distance from Hole to Hole | 10mil | The Minimum SMT Design | â¥7mil |
Solder Mask | |||
SM Bridge Width | â¥4mil | Minimum Width of Legend | 4mil |
Minimum Size of SM Window | 3milï¼Partially 2.5milï¼ | Minimum Hight of Legend | 23mil |
The Minimum Distance from SM Window to Other Out | 3mil | ||
Surface Finished | |||
HASLãENIGãENEPIGãSoft bonding gold(Soft Gold Plating)ãHard Gold PlatingãImmersion SilverãOSPãImmersion TinãENIG+OSPãENIG+G/F | |||
Impedance | |||
Whether it is capable of impedance testing | Yes, it capable, it have |