Semiconductor test board:
PCB Layer: 16Layer
Material: FR4 High TG
Board thickness: 5.08mm,
Finishing copper thickness: inner and outer 2/2oz,
Surface finished: ENEPIG.
Special technology:
1.Blind and Buried vias with 0.1mm in L1-L2,L2-L3,L14-L15,L15-L16,
2.impedance control 50 ohm +/-10%.
3.Contersink holes
The board used a special surface finishing ENEPIG, itâs fantastic for ping board.
This board used in semiconductor test board.