Alumina Wafer Polishing Plate / Turn Table

1： Application:

As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapre and Wafer.

2： Features :

- High rigidity (Hardness, Mechanical Strength, Wear Resistance)

- High chemical durability

- Surface shape & roughness control

- Pretty Price

3： Size:

- Disc, ring size below ∅850mm, thickness 45mm.

- For example: D150mm, D360mm,D 600mm.

- Customized products with various size are accepted.