Laser drilling for the Ceramic substrate

description:laser drilling for the Ceramic substrate

keywords:drill for the Ceramic substrate/micro drilling of Electronic board/Drill small holes in Ceramic plate.

Thick film hybrid technology is based on the application of specially formulated pastes using the screen printing technology onto the alumina ceramic substrate. This way it is possible to create conductive and dielectric layers, conductive interconnects and printed resistors of various shapes. This technology allows gluing and bonding of non-encapsulated semiconductor chips onto the ceramic substrate and at the same time.

In Deli laser  there is a laser used for drilling of alumina ceramics. It is especially used by the department of development and production of hybrid integrated circuits, however, it also ensures cutting or scribing of ceramics based on customers' requirements.Â