Layers: 4 Layer
PCB material: FR4 High Tg(S1000-2)
Board Thickness: 0.6mm
Surface Finishing: ENEPIG
Finished Copper thickness:1/1/1/1 oz
Special Technology:
1. Minimum trace width/space: 3/3mil(0.08mm)
2. Small BGA pad: 3.9mil(0.1mm)
3. Minimum vias diameter: 6mil(0.15mm)
Used in 3D printer product.