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Micro BGA/PBGA/CBGA/TBGA/FPGA/CGA/LGA High layer 18L/1.5mm PCB in Communication

  • Origin: China
  • Supply Type: oem service
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Supplier Info.

  • Employees Total 301-500
  • Annual Revenue

Application Field: Communication

Layer/Board Thickness: 18L/1.5mm

Surface Treatment: ENIG

e: 4.0/4.0mil

Smallest Hole Diameter: 0.2mm

Technical Feature: impedance control

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