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HDI PCB Via-in-pad Filled vias thin laminate and prepreg

  • Origin: China
  • Supply Type: oem service
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Supplier Info.

  • Employees Total 301-500
  • Annual Revenue

Application Field: Communication

Layer/Board Thickness: 8L/1.5mm

Surface Treatment: ENIG

e: 4.0/4.0mil

Smallest Hole Diameter: 0.15mm

Technical Feature: 1+1+4+1+1，Micro vias，plugged resin and plated over

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