As a professional PCB manufacturer, we have factories in Guangdong, Jiangxi, and Hunan, using advanced production equipment to ensure the high quality of our products. We have 10 PCB production e machine works 24 hours a day, only to provide customers with satisfactory delivery time. In addition, all our products have obtained ISO-9001 quality system certification, ISO-14001 environmental system certification, and UL certification.
SPEEDAPCB has been focusing on producing various rigid PCB, flexible PCB, and rigid-flex PCB.
SPEEDAPCB can provide you:
Stable quality: We use advanced PCB machines and test equipment to ensure stable and stable PCB quality during production.
Super cost-effective.
On-time delivery service: double-sided can be completed within 24 hours, and the fourth floor will be ready within 72 hours.
Rigid printed boards include nolic paper laminates, epoxy paper laminates, polyester glass felt laminates and epoxy glass cloth laminates.
Process Capability And Checking Parameters(Hard Board)
| NO | ITEM | Technical Capabilities |
| 1 | Layers | 2-52L |
| 2 | Max.Board Size | 1200*610mm |
| 48"*24" | ||
| 3 | Finished Board Thickness | 0.2mm--10.0mm,17.5mm for samples |
| 0.008"--0.4" | ||
| 4 | Finished Copper Thickness | 17um-420um |
| 0.5OZ--12OZ | ||
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm |
| 0.003"/0.0026" | ||
| 6 | Min.Hole Size | 0.15mm |
| 0.006" | ||
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm |
| ±0.002" | ||
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm |
| ±0.002" | ||
| 9 | Drill Location Tolerance | ±0.05mm |
| ±0.002" | ||
| 10 | V-Cut Degrees | 20-90 ºC |
| 20DEG-90DEG | ||
| 11 | Min.V-Cut PCB Thickness | 0.4mm |
| 0.016" | ||
| 12 | N/C Routing Tolerance | ±0.1mm |
| ±0.004" | ||
| 13 | Min.Blind/Buried Via | 0.15mm |
| 0.06" | ||
| 14 | Plug Hole Size | 0.2mm--0.6mm |
| 0.008"--0.024" | ||
| 15 | Min.BGA PAD | 0.2mm |
| 0.008" | ||
| 16 | Materials | FR4,Aluminium,High Tg,Halogen-free,Rogers,ShengYi,KB |
| 17 | Surface Finish | LF-HAL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HAL+G/F |
| 18 | Warp & Twist | ≤0.75% |
| 19 | Electrical Testing | 50--300V |
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% |
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles |
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm |
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times |
Process Capability - Technical Parameters(FPC)
| Content | Common | Special | Surface treatment | Thickness |
| Minimum h | 0.07mm | 0.05mm | Electroplated nickel gold | Ni:3-9um;Au:0.03-0.1um |
| Minimum ing | 0.07mm | 0.05mm | ||
| Minimum Drilling aperture | Φ 0.15mm | Φ 0.1mm | ||
| Aperture Tolerance | ±0.1mm | ±0.05mm | Chemical immersion gold | Ni:3-5um;Au:0.03-0.1um |
| Maximum imposition size(single panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | ||
| Maximum imposition size(double panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | ||
| Maximum imposition size(single panel & double panelno PTH self-drying ink + UV light solid) | 610*1650mm | Electroplated hard gold | Ni:2-9um;Au:0.1-0.3um | |
| Finished board impedance tolerance | ±10% | Electroplated pure tin | Sn:3-7um | |
| Maximum production layer | 12L | |||
| Thickness To Diameter Ratio | 2:1(Minimum aperture 0.1mm) | |||
| 5:1(Minimum aperture 0.2mm) | Anti-oxidation | |||
| 8:1(Minimum aperture 0.3mm) | ||||
| Monthly production capacity/m² | 16000 m² | |||
Material
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) |
| Conductive Medium | Copper foil(1/3oz,1/2oz,1oz,2oz) |
| Constantan | |
| Silver Paste | |
| Copper Ink | |
| Adhesive | Epoxy resin, Acrylic, Adhesion |
| Solder Mask / Protective Film | PI(0.5mil,1mil,2mil)(Yellow, White, Black) |
| PET(1mil,2mil) | |
| Solder mask (green, yellow, black...) | |
| Glue | 3M467,3M468,3M9077,TESA8853... |
| Reinforcement Type | PI,FR4,PET,Steel,Aluminum... |
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