Base Material | FR-4,Aluminum,High Tg FR4 |
Copper Thickness | 1oz |
Board Thickness | 1.6mm |
Min. Hole Size | 0.2 Mm |
Min. Line Width | 0.1mm |
Min. Line Spacing | 4/4mil(0.1/0.1mm) |
Surface Finishing | Immersion Gold |
Solder mask color | Green. Red. Blue. White |
Number of layers: | 2-28 |
Blind & Buried vias | Yes |