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Thermal conductive silicon thermal pad 3.0w/m.k exclusively for CPU

  • Origin: China
  • Supply Type: oem service
  • Processing Time: 7days
  • Min Order: 100

Supplier Info.

  • Employees Total 11-50
  • Annual Revenue Below US$1 Million

Key Specifications/Special Features:

Can be customized to any dimension,and can be smeared with adhesive!It's made by mixing silicon grease,thermal conductive paste,ZnO,and some other chemical materials and then processing by high temperature vulcanization,it's a kind of highly active heat absorbing material,looking from the side angle,a kind of fine microporous structure is formed inside the material,this kind of microporous structure not only make the pad with strong heat absorbing ability,also with the initiative heat conduction function,when filling into the gap between heating device and heatsink or metab.

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