Printed Circuit Board (PCB)Â depaneling machinery,UV Fpc Laser Cutting Machine,SMTfly-5LÂ Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Power | 10W/12W/15W/17W@30KHz |
| Positioning Precision of Worktable of tor | ±2μm |
| Repetition Precision of Worktable of tor | ±1μm |
| Effective Working Field | 460mmX460mm(Customizable) |
| Laser Scanning Speed | 2500mm/s (max) |
| Galvanometer Working Field Per One Process | 40mmÑ…40mm |
High capacity BOFA dust collectorUser friendly Window based softwarePCB flexible product jig adjustable for different board sizeHigh resolution and accurate Z stage with auto-focus functionLarge area low friction front loading platform for sliding multiple product jigsFully covered class 1 safety enclosureAble to do cutting and marking togetherIncreasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.PCB Separator,PCB Cutting with Flex Pcb UV Laser Depanelizer Machine with CE CertificationPCB Separator by Using UV Laser Fpc Cutting,SMTfly-5LÂ Features:Pre-camera vision product position registration and model checkCoherent Avia NX UV laser with HurrySCAN headCompact size
 Video of Laser PCB/FPC Cutting Using Laser with CE Certification Sample:       ![]()
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PCB Depanelizer Machine,FPC Cutter with Flex Pcb Separated Machine,SMTfly-5LÂ Description:PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sosticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.![]()
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