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Laser Depaneling of PCBs,Depaneling-Circuit Boards,PCB & FPC Separator Equipment,SMTfly-5L
DIY PCB Cutter,PCB V Cut Sepecification with Laser Cutting Machine,SMTfly-5LÂ Features:
PCB Laser Separator Equipment Specification:
Laser class | 1 |
Max. working area (X x Y x Z) | 300 mm x 300 mm x 11 mm |
Max. recognition area (X x Y) | 300 mm x 300 mm |
Max. material size (X x Y) | 350 mm x 350 mm |
Data input formats | Gerber, X-Gerber, DXF, HPGL, |
Max. structuring speed | Depends on application |
Positioning accuracy | ± 25 μm (1 Mil) |
Diameter of focused laser beam | 20 μm (0.8 Mil) |
Laser wavelength | 355 nm |
System dimensions (W x H x D) | 1000mm*940mm*1520 mm |
Weight | ~ 450 kg (990 lbs) |
Power supply | 230 VAC, 50-60 Hz, 3 kVA |
Cooling | Air-cooled (internal water-air cooling) |
Ambient temperature | 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil) |
Humidity | < 60 % (non-condensing) |
Required accessoires | Exhaust unit |
Working principle :
humidity sensor ( humidity and temperature †’ Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )
Description:
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sosticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
Dvantages:
1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
3.Reduce energy consumption, Cost savings.
Cost-effective, fast cutting speed, stable performance
Laser PCB depaneling machine Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
If you need the machine,please us:
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