High Accuracy FPC / Rigid - Flex PCB Laser depaneling machine,SMTfly-5L Description:
Product Name: | Laser Pcb Separator | Super: | Low Power Consumption. |
Laser: | 12/15/17W | Laser Brand: | Optowave |
Power: | 220V 380v | Warranty: | 1 Year |
Advantages of Laser Fpc Cutting/singulation:
No mechanical stress on substrates or circuits
No tooling cost or consumables.
Versatility â ability to change applications by simply changing settings
Fiducial Recognition â more precise and clean cut
Optical Recognition before PCB depaneling/singulation process begins.
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50 microns.
No design limitation â ability to cut virtually and size PCB board including complex contours and multidimensional boards
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:
· Damages and fractures to substrates and circuits due to mechanical stress
· Damages to PCB due to accumulated debris
· Constant need for new bits, custom dies, and blades
· Lack of versatility â each new application requires ordering of custom tools, blades, and dies
· Not good for high precision, multi-dimensional or complicated cuts
· Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-process.
PCB (printed circuit board) Depaneling using UV Laser,SMTfly-5L Specification:
Laser | Q-Switched diode-pumped all solid-state UV laser |
Laser Wavelength | 355nm |
Laser Power | 10W/12W/15W/17W@30KHz |
Positioning Precision of Worktable of tor | ±2μm |
Repetition Precision of Worktable of tor | ±1μm |
Effective Working Field | 460mmX460mm(Customizable) |
Laser Scanning Speed | 2500mm/s (max) |
Galvanometer Working Field Per One Process | 40mmÑ 40mm |
Laser class | 1 |
Max. working area (X x Y x Z) | 300 mm x 300 mm x 11 mm |
Max. recognition area (X x Y) | 300 mm x 300 mm |
Max. material size (X x Y) | 350 mm x 350 mm |
Data input formats | Gerber, X-Gerber, DXF, HPGL, |
Max. structuring speed | Depends on application |
Positioning accuracy | ± 25 μm (1 Mil) |
Diameter of focused laser beam | 20 μm (0.8 Mil) |
Laser wavelength | 355 nm |
System dimensions (W x H x D) | 1000mm*940mm*1520 mm |
Weight | ~ 450 kg (990 lbs) |
Power supply | 230 VAC, 50-60 Hz, 3 kVA |
Cooling | Air-cooled (internal water-air cooling) |
Ambient temperature | 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil) |
Humidity | < 60 % (non-condensing) |
Required accessoires | Exhaust unit |
PCB Laser Depaneling Machine with UV Laser,SMTfly-5L Cutting Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
PCBa Cutting by Using UV Laser Pcb Separator Machine Sample Video:
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Tag:Â Laser Pcba Separator Machine,Pcb Fpc Depanelization Solutions
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