This product is suitable for the cutting and cleaning of semiconductor wafers and optoelectronic materials, focusing on reducing electrostatic accumulation and sawdust particle pollution in the manufacturing process. It has good dirt dispersion ability and anti-static ability, and the particles after cutting will not adhere to the product. The lubrication and cleaning effect is exnt, and there is no corrosion to the workpiece, making it green and environmentally friendly.
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