Bonding Sheet Using the ACF(Anisotropic Conductive Film) from LCM Module Process of FPC and TFT-LCD, and is used for applications that are mounted PCB Ass'y and Drive Ass'y, the Panel Ass'y. And Tool from the heat of the TCP, PCB protects and heat pumping is used as a buffer sheet. It is Show More...
Bonding Sheet Using the ACF(Anisotropic Conductive Film) from LCM Module Process of FPC and TFT-LCD, and is used for applications that are mounted PCB Ass'y and Drive Ass'y, the Panel Ass'y. And Tool from the heat of the TCP, PCB protects and heat pumping is used as a buffer sheet. It is used as an insulating thermal pad sheet, various types of semiconductor which requires high thermal conductivity, and electronic parts elsewhere.
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