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Multilayer PCB Lamination Sequence: Key Steps and PrecautionsIn the field of electronics manufacturing, multilayer boards (also known as multilayer printed circuit boards, or PCBs for short) are a common type of electronic component. They typically consist of multiple copper foil layers, insulating layers, and conductive layers that are used to connect various electronic components. To ensure the quality and performance of multilayer boards, the correct lamination sequence is critical. In this article, we will introduce the key steps and considerations for laminating multilayer PCBs.1. PreparationPrior to laminating a multilayer panel, a detailed inspection of all layers is required to ensure that all materials meet the design requirements. This includes:- Checking the thickness and quality of the copper foil layer to ensure there is no oxidation or contamination.- Checking the thickness and quality of the insulation layer to ensure there are no breakages or defects.- Check the thickness and quality of the conductive layers to ensure there is no oxidation or contamination.- Ensure that all pads, vias and wires have been properly plated with a thin layer of gold or tin.2. Lamination ProcessThe multilayer board lamination process usually includes the following steps:- Cleaning: First, the copper foil layer, insulation layer and conductive layer need to be cleaned to remove oil, dust and other impurities from the surface. This step is essential to ensure the quality of the lamination.- Pre-pressing: After cleaning, the layers need to be pre-pressurized to ensure that they fit tightly together. During pre-compression, a release film is placed between the layers to prevent them from sticking together under pressure.- Formal lamination: After pre-compression, the layers need to be placed in the laminator for formal lamination. During the lamination process, parameters such as temperature, pressure and time need to be controlled to ensure that the adhesion between the layers meets the expected requirements. Cooling: After the lamination is completed, a release film needs to be placed between the layers to prevent them from sticking together under pressure.- Cooling: After the lamination is completed, the multilayer board needs to be removed from the laminator and placed on a flat surface for cooling. During the cooling process, it is necessary to avoid the multilayer being subjected to external forces to prevent it from being deformed or delaminated.3. Post-treatmentAfter the cooling of the laminate is completed, some post-treatment work is required to ensure its quality and performance. This includes:- Cutting: Cutting the multilayer into the required shape and size according to the design requirements.- Drilling: Drill the required holes in the multilayer board for mounting electronic components.- Copper sinking: During the drilling process, some copper chips may be generated. In order to ensure the conductivity of the multilayer board, these copper chips need to be cleaned up and the drilled holes need to be copper-immersed.- Surface treatment: In order to improve the solderability and corrosion resistance of multilayer boards, it is usually necessary to carry out surface treatment, such as gold plating, tin plating or spraying protective lacquer.

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