Technologies
●Any layer HDI
●Aspect ratio up to 25
●Back drill
●Board thickness 10 mm / 390 mil
●Cavity down
●High speed and low loss materials
●Layer count up to 40
●Micro via copper-fill plate
●Minimum line width / spacing 2 mil
●Thermal management-coin inserted
●VIP (via in pad) :
conductive-conductive copper paste ;
non-conductive-epoxy via hole fill
Applications
Optical Fiber Conversion Module, Ethernet Module, Small form Factor Pluggable (SFP) System and Thunderbolt
