Quick Details
- Processing Time:-
- Port:-
- Supply Ability: -
- Brand Name:-
Technologies
●Any layer HDI
●Aspect ratio up to 25
●Board thickness range from 10 mil to 390 mil(0.25 to 9.0 mm)
●Flex-rigid board
●Heavy-copper products up to 6 oz (210 µm)
●High speed, low loss and high performance materials
●Layer count up to 40
●Minimum line width / spacing 2 mil
●Thermal management-coin inserted
●Tightened impedance control tolerance
●VIP (via in pad) :
conductive- conductive copper paste ;
non-conductive-epoxy via hole fill
Applications
Power Management System, Storage System, Tablet PC, Embedded Computer System, Positioner, NC Rotary Table, Hydraulic Parts Leveler, Grinding Machine, Stainless Steel Cleaning Machine and
Embossing Machine
