Quick Details
- Processing Time:-
- Port:-
- Supply Ability: -
- Brand Name:-
Technologies
●Any layer HDI
●Aspect ratio up to 25
●Back drill
●Board thickness range from 10 to 390 mil (0.25 to 9 mm)
●High speed and low loss materials
●Layer count up to 40
●Micro via Cu fill
plate
●Minimum line width / spacing 2 mil
●VIP (via in pad) :
conductive-conductive copper paste;
non-conductive-epoxy via hole
fill
Applications
Server, Notebook Computer, Cloud Server, Telecommunication Equipment, Computer Camera Accessories, WIFI Base Station, Set-top Box Microconsole, Smartwatch, Disk Storage System, Network Switch,
IOT(Internet of Things), Storage Area Network, Gaming Controller, Docking Station, Remote Control, Projector, Monitor and Integrated Touch Panel
