Quick Details
- Processing Time:-
- Port:-
- Supply Ability: -
- Brand Name:-
Technologies
●Any layer HDI
●Aspect ratio up to 25
●Back drill
●Board thickness 10 mm / 390 mil
●Cavity down
●Diversity specialty processes PCB & PCBA
●Heavy-copper products up to 6 oz(210 µm)
●High speed, low loss and multiple material combination / RF microwave high performance material
●IPC-A-600 class 3 certified products
●Layer count up to 40
●Metal core PCB (aluminum & copper)/coin thermal management
●Micro via Cu fill plate
●Minimum line width / spacing 2 mil
●Rigid-flex PCB
●Tightened impedance control tolerance
●VIP (via in pad) :
conductive-copper paste / conductive paste ;
non-condective-epoxy via hole fill
Applications
Satellite Antenna, Fiber Optic Broadband, Broadband Central Office, LNB (Low Noise Block Down Converter), VSAT (Very Small Aperture Terminal), Microwave Radio System, RFID Reader System,
Communication Base Station Equipment and 4G LTE Device
