Rohs 94v0 Electronic 2 Layers PCB Printed Circuit Board Prototype Assembly Manufacturer

PCB Capability  Capability Standard   Advanced Laminate materials FR4 / FR1 / CEM-3 / CEM-1 / Aluminum / Teflon / High-TG / Rogers / Taconic Surface Finish HASL (vertical & Horizontal), Lead Free HASL, HASL+Gold Finger, OSP/Entek, ENIG, ENEPIG, Immersion Tin(ISn) ,Immersion Silver(IAg), Carbon Ink,  Hard Gold(Flash Gold), Soft Gold Min. Thickness for inner layers 0.020"-0.125" 0.003”(0.07mm) Board layers 1-12 Layers 1-24 Layers Board Thickness 0.5mm-3mm 0.2mm-7mm Copper weight 0.5 oz – 3 oz 0.5 oz – 6 oz Minimum Trace Width / Spacing 0.004"/0.004" 0.003"/0.003" Solder Mask Color Green,Blue,Black,Red,Yellow,White, and customized   Drill deviation 0.008" ±0.002” (0.05mm) PTH hole tolerance 0.008" ±0.002” (0.005mm) NPTH hole tolerance 0.008" ±0.002” (0.005mm) Min hole size 0.010" 0.008” (0.02mm) E-test Flying Probe Tester/ Test-Jig/X-ray/ICT/AOI/FCT Controlled Tolerance ±15% ±10% Silkscreen Color White, Black, Yellow, Green, Red, Blue and customized   Min solder mask clearance size 0.008 0.003” (0.07mm) Thickness 0.020"-0.125" 0.0005-0.0007”(0.012-0.017mm) Min silkscreen clearance size 0.010" 0.006” (0.15mm) IPC Class Class 2 Class 3 Blind Vias YES YES Buried Vias YES YES Aspect Ratio 8/1 15/1 Peelable Mask YES YES Carbon Ink YES YES Solder Sample YES YES First Article YES YES Certificate: UL / SGS / ROH / ISO/ TS16949 / ISO14001:2004 Acceptable file format GERBER file,  PROTEL 99/PADS / POWER PCB / AutoCAD /EGLE PCB Assembly Capability  Item Capability Advantages ----Professional Surface-mounting and Through-hole soldering   technology ----Various sizes like 1206,0805,0603 components SMT  technology ----ICT(In Circuit Test),FCT(Functional Circuit Test)                                    ----PCB Assembly With UL,CE,FCC,Rohs Approval ----Nitrogen gas reflow soldering technology for SMT. ----High Standard SMT&Solder Assembly Line ---High density interconnected board placement technology    capacity. Components Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement Quantity Prototype & Low Volume PCB Assembly, from 1 Board to 250, or up to 1000 and customized Type of Assembly SMT, Thru-hole Solder Type Water Soluble Solder Paste, Leaded and Lead-Free Bare Board Size Smallest:0.25*0.25 inches Largest:20*20 inches File Formate Gerber files, Pick-N-Place file, Bill of Materials Types of Service Turn-key,partial turn-key or consignment Component packaging Cut Tape,Tube,Reels,Loose Parts Turn Time Same day service to 15 days service Testing Flying Probe Test,X-ray Inspection AOI Test PCB assembly process Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing