Quick Details
- Processing Time:3-35days(according to the actual condition )
- Port:ShenZhen
- Supply Ability: 200000SQM Cartons Per Day
- Brand Name:SEMSHINE
Product Description
1. IntroductionAs a kind of Double-sided Fr4 pcb, it is widely used in Computer and NB, Instruments, Consumer electronics, Automotive electronics
etc.Halogen, antimony and red phosphorous freeExcellent thermal reliabilityL Z CTEAnti-CAF capability
fr4 laminate double sided pcb supplier:SEMSHINE
2. Material: Fr4 Laminate pcb
Test Item
Test Method
(IPC-TM-650)
Test Condition
Unit
Specification
Typical Value
Thermal
Thermal
Stress
24.13.1
Float 288℃/Unetched
Sec
≥10
≥240
Glass Transition
(Tg)
2.4.25
E-2/105 DSC
℃
≥10
175
CTE/ Z-Axis Expansion
2.4.24
Alpha 1
ppm/℃
≤60
40
Alpha 2
≤300
200
50 - 260 ℃
%
≤3.0
2.2
X/Y CTE
2.4.24
40℃ - 125℃
ppm/℃
——
12/15
T-260
2.4.24.1
TMA
min
≥30
>60
T-288
2.4.24.1
TMA
min
≥15
>60
TD(5% weight loss)
2.4.24.6
TGA
℃
>340
385
Flammability
UL94
E-24/ 23
Rating
V-0
V-0
Electrical
Surface Resistivity
2.5.17.1
C-96/35/90
MΩ
≥104
3.7*108
Volume Resistivity
2.5.17.1
C-96/35/90
MΩ-cm
≥106
4.3*109
Dielectric Breakdown
2.5.6
D-48/ 50+D0.5/ 23
kV
≥40
≥45
Dielectric Constant
2.5.5.2
Etched
(RC 50%)
@ 1 MHz
@ 1 GHz
—
≤5.4
4.8
4.6
Loss Tangent
2.5.5.2
Etched
(RC 50%)
@ 1 MHz
@ 1 GHz
—
≤0.035
0.012
0.013
CTI
IEC60112
A
V
——
>600
Arc Resistance
2.5.1
D-48/ 50+D-0.5/ 23
Sec
≥60
121
Mechanical
Peel Strength (1 oz.)
2.4.8
125 ℃
N/mm
≥0.70
1.3
Float 288 ℃/ 10 Sec
≥1.05
1.4
After Process Solution
≥0.80
1.1
Flexural Strength
2.4.4
Length Direction
N/mm2
≥415
602
Cross Direction
≥345
534
Moisture Absorption
2.6.2.1
D-24/23
%
≤0.5
0.11
3. Certification: UL, ROHS, Reach, ISO4. Use range: Lighting, Automotive electronic equipment, Power supply, Electronic control, Computer
equipment, Communication electronics etc.5. What exhibitions have we participated?New Delhi Exhibition, Moscow Electronic Exhibition etc.
6. Our Services1.Quick response2.Reasonable price based on good quality3.Provide one-stop service(components, OEM)4.Abundant inventory & Habitual material preparation