Quick Details
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- Brand Name:Grande
Supplier: Grande Electronics
Layers: 4
Application: Communication Server PCB Board - Grande - PCB Assembly Manufacture
PCB Parameter: FR-4/HTG150
Thickness: 1.6mm
Surface Treatment: ENIG
Testing: 100% E-test
Package: Vacuum packing
Lead Time: 10-15 days
Description:
PCB Capabilities
Layers: 1-30
Quantity: 25,000 sq.m/month
PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB
PCB Basic Material Brand
HF: Rogers, Taconic
HTG: S1000-2M, Lianmao IT180A
Solder Mask: Taiyo PSR-2000/4000 Series
Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated
Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger
PCB Technical Parameters
Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz)
Min Via: 0.15mm/0.1mm(Laser)
Min Annular Ring: 4mil
Max copper thickness: 7oz
Max size: 650x1100mm
Thickness Aperture Ratio: 20: 1
Tolerance
PTH: +/-0.0075mm (min: +/-0.05mm)
Outline: +/-0.1mm (min: +/-0.05-0.075mm)
