Thru Hole SMT OSP FR4 Electronics Automotive PCB Assembly

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PCB Assembly Introduction For Turnkey PCB Assembly, all you need to do is to send us your PCB assembly Bill of Materials (BOM) list. ( a document or a spreadsheet format containing the PCB specification selection ), the number of layers, quantity, and all dimensions necessary. In addition, you also need to include a CAD-generated Gerber or Centroid file for the top/bottom copper, Silkscreen and other details. Next, we will send a formal quote for your order approval before production . you can fix it if there’s any problem . A summary of the process for a turnkey PCB assembly order : Place Order Component procurement PCB Design PCB Assembly Quality assurance and testing Prototyping Packing Shipping Aftersales services and support PCB CAPABILITIES  FACTORY CAPABILITIES No. Items 2019 2020 1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5) 2 Max layer count 32L 36L 3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm 4 Min.Hole Size Laser 0.075mm Mechnical 0.15 Laser 0.05mm Mechnical 0.15 5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm 6 Copper Thickness 1/3oz-4oz 1/3oz-6oz 7 Size Max Panel size 700x610mm 700x610mm 8 Registration Accuracy +/-0.05mm +/-0.05mm 9 Routing Accuracy +/-0.075mm +/-0.05mm 10 Min.BGA PAD 0.15mm 0.125mm 11 Max Aspect Ratio 10:1 10:1 12 Bow and Twist 0.50% 0.50% 13 Impedance Control Tolerance +/-8% +/-5% 14 Daily output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment) 15 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD 16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI