Layer Count & Material
Layers
1-8Layers
Maximum Panel Size
19.6*31.0 inch
Maximum Single Unit Size
9inch*14inch （limitation is 9inch*23inch）
Minimum Panel Size
9.0*12.0 inch
Board Size Tolerance
±0.1mm
Maximum Finished Board Thickness
0.80mm
Minimum Finished Board Thickness
0.05mm
Trace/Line
Minimum Line Width for Inner Layers
3mil
Minimum Line Spacing for Outer Layers
3.5mil
Minimum Line Width for Outer Layers
3mil
The Copper Thickness for Inner Layers
≤2OZ
Minimum Line Spacing for Inner
3mil
The Copper Thickness for Outer Layers
≤3OZ
Drilling
Minimum Hole Diameter
0.15mm
Minimum Distance from Hole to Board Outline
8mil
Maximum Hole Diameter
6.4mm
Minimum Size for Hole Ring
4mil （Partially 3.2mil）
Hole Diameter Tolerance
±2mil
The Minimum BGA Bonding Pad Design
≥8mil (7mil is
the Limitation)
The Distance from Hole to Hole
10mil
The Minimum SMT Design
≥7mil
Solder Mask
SM Bridge Width
≥4mil
Minimum Width of Legend
4mil
Minimum Size of SM Window
3mil（Partially 2.5mil）
Minimum Hight of Legend
23mil
The Minimum Distance from SM Window to Other Outline
3mil
Surface Finished
HASL、ENIG、ENEPIG、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F
Impedance
Whether it is capable of impedance testing
Yes, it capable, it have
