Small BGA Pad PCB

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King Sun PCB Technology

China

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Layers: 4 Layer PCB material: FR4 High Tg(S1000-2) Board Thickness: 0.6mm Surface Finishing: ENEPIG Finished Copper thickness:1/1/1/1 oz Special Technology: 1. Minimum trace width/space: 3/3mil(0.08mm) 2. Small BGA pad: 3.9mil(0.1mm) 3. Minimum vias diameter: 6mil(0.15mm) Used in 3D printer product.

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