Micro BGA/PBGA/CBGA/TBGA/FPGA/CGA/LGA High Layer 18L/1.5mm PCB In Communication

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HX Circuit Technology Co.,Ltd.

China

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Application Field: Communication Layer/Board Thickness: 18L/1.5mm Surface Treatment: ENIG Line/Space: 4.0/4.0mil Smallest Hole Diameter: 0.2mm Technical Feature: impedance control

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